Mijing 3D BGA Reballing Stencil for iPhone A15/A14/A13/A12/A11/A10/A9/A8

Mijing 3D BGA Reballing Stencil for iPhone A15/A14/A13/A12/A11/A10/A9/A8

A15 for iPhone 13 Series 

A14 for iPhone 12 Series 

A13 for iPhone 11 Series 

A12 for iPhone XsMax 

A12 for iPhone Xs/XR 

A11 for iPhone 8/8P/X 

A10 for iPhone 7/7P 

A9 for iPhone 6S/6SP 

A8 for iPhone 6/6P 

Feature:

• Stepped groove design enables stencil to align with the tinning position of ic rapidly.
• The square holes design makes it easier to take out the formed solder balls.
• This 3D stencil is easy to use no matter you are new or an expert.
• The high success rate of planting tin, the solder balls can be formed once after you are proficient.
• This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.