RELIFE No-clean Soldering Paste RL-400 RL-401 RL-402 40g Sn63/Pb67 183°C Solder Paste for iphone phone BGA Reballing Soldering

RELIFE No-clean Soldering Paste RL-400 RL-401 RL-402 40g Sn63/Pb67 183°C Solder Paste for iphone phone BGA Reballing Soldering

Description:

100% brand new and high quality Unique recipes, perfect performance, easy to weld, solder bright and full, no weld, false welding and so on Good soldering and welding too Application: Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc. Specifications: Alloy ratio: Sn63/Pb37 Viscosity: 160-230Pa.s The size of granule: 20-38um Model Content Melting point RL-400 20g 183 RL-401 30g 183 RL-402 40g 183