XZZ L2023 Motherboard Layered Adjustable Temperature Tin Planting Bonding Soldering Heating Table For iPhone X-14PRO MAX Android
- Availability: In Stock
- Product Code: PFXZZ10
XZZ L2023 Motherboard Layered Adjustable Temperature Tin Planting Bonding Soldering Heating Table For iPhone X-14PRO MAX Android
Features:
1. XZZ L2023 intelligent desoldering station, no damage to the motherboard, temperature display clearly and accurate control at any time .
2. When the preset temperature is reached, the beeping alarm will be turned on to prevent overheating damage to the motherboard.
3. With fast temperature rise, long life, uniform temperature, fast and low thermal complementary growth characteristics,the perfect appearance of the air duct design is more conducive to heat dissipation.
4. Support Android and iPhone X-14 series motherboard lamination separation, screen bracket separation, etc., subsequent continuous updates.
5. Extra large heating area, support for Android phones, large operating area, good compatibility.
6. Innovative design, strong magnetic adsorption, built-in multiple strong magnetic,easy to disassemble,Synthetic stone compression clasp, makes the motherboard fit better.
